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UID:submissions.supercomputing.org_SC21_sess266_exforum114@linklings.com
SUMMARY:Optimized Component Thermal Management and Mitigation Techniques i
 n HPC Applications
DESCRIPTION:Exhibitor Forum\n\nOptimized Component Thermal Management and 
 Mitigation Techniques in HPC Applications\n\nRiley\n\nJoin Samtec as we di
 scuss ideas and tricks of the trade for mitigating thermal issues in the c
 omponent selection in HPC applications. Technical experts from Samtec will
  highlight the benefits to immersion cooling, routing signals over PCBs an
 d low profile designs for high speed, high power applications. Selecting t
 he correct component is part of the equation; how you apply that component
  in your application can give you the edge in getting the highest performa
 nce in next-generation HPC system design.\n\nTag: Architectures, Green Com
 puting\n\nRegistration Category: Tech Program Reg Pass, Exhibit Hall Only
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