BEGIN:VCALENDAR
VERSION:2.0
PRODID:Linklings LLC
BEGIN:VTIMEZONE
TZID:America/Chicago
X-LIC-LOCATION:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:19700308T020000
RRULE:FREQ=YEARLY;BYMONTH=3;BYDAY=2SU
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:19701101T020000
RRULE:FREQ=YEARLY;BYMONTH=11;BYDAY=1SU
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20211207T054746Z
LOCATION:263
DTSTART;TZID=America/Chicago:20211117T140000
DTEND;TZID=America/Chicago:20211117T143000
UID:submissions.supercomputing.org_SC21_sess266_exforum118@linklings.com
SUMMARY:Addressing the Challenge of Efficient, Scalable and Green Thermal 
 Management of Future High-Performance Computing
DESCRIPTION:Exhibitor Forum\n\nAddressing the Challenge of Efficient, Scal
 able and Green Thermal Management of Future High-Performance Computing\n\n
 Logar\n\nVarious global industries are in need of more efficient computati
 onal power in an ever-smaller footprint. To accommodate increasing demands
 , the power density of chips and their heat generation have increased beyo
 nd the practical limits of air cooling. Therefore, in high-density chips, 
 alternative thermal management methods such as liquid cooling must be cons
 idered.  \n\nWater or glycol-based coolants have the adv
 antage of several times higher heat conductivity and specific heat capacit
 y compared to air. This allows them to quickly absorb and carry large amou
 nts of heat energy away from the densely packed transistors in modern chip
 s. Such cooling capabilities enable the chips to stay cooler and run more 
 efficiently, lowering the power consumption with the same workloads. From 
 our observations of self-contained, fully liquid-cooled rack-mounted serve
 rs, there is a noticeable power consumption reduction when GPU and CPU cor
 es are significantly below the thermal throttle limit.   \n\nC
 hip transistor density is not the only challenge. Space in existing and ne
 wly built facilities is at a premium and strictly regulated. This translat
 es into the need for increased server component density.  Standard air coo
 ling requires bulky fin stacks and heat pipe arrays with high-speed fans o
 n high-power add-in boards. Replacing these fin stacks with purpose-built 
 water blocks significantly reduces the total thickness and enables tighter
  spacing of the components. \n\nWe will also discuss the possibilities of 
 better waste heat reuse in facility-level liquid cooling systems, lowering
  the overall environmental impact of HPCs. \n\nTag: Architectures, G
 reen Computing\n\nRegistration Category: Tech Program Reg Pass, Exhibit Ha
 ll Only
END:VEVENT
END:VCALENDAR