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LOCATION:263
DTSTART;TZID=America/Chicago:20211117T133000
DTEND;TZID=America/Chicago:20211117T150000
UID:submissions.supercomputing.org_SC21_sess266@linklings.com
SUMMARY:Exhibitor Forum
DESCRIPTION:Exhibitor Forum\n\nExhibitor Forum Session V (In-Person presen
 tations): Energy Considerations and Systems\n\nOptimized Component Thermal
  Management and Mitigation Techniques in HPC Applications\n\nRiley\n\nJoin
  Samtec as we discuss ideas and tricks of the trade for mitigating thermal
  issues in the component selection in HPC applications. Technical experts 
 from Samtec will highlight the benefits to immersion cooling, routing sign
 als over PCBs and low profile designs for high speed, high power applicati
 ...\n\n---------------------\nAddressing the Challenge of Efficient, Scala
 ble and Green Thermal Management of Future High-Performance Computing\n\nL
 ogar\n\nVarious global industries are in need of more efficient computatio
 nal power in an ever-smaller footprint. To accommodate increasing demands,
  the power density of chips and their heat generation have increased beyon
 d the practical limits of air cooling. Therefore, in high-density chips, a
 lternative t...\n\n\nTag: Architectures, Green Computing\n\nRegistration C
 ategory: Tech Program Reg Pass, Exhibit Hall Only
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