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X-LIC-LOCATION:America/Chicago
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TZOFFSETFROM:-0500
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RRULE:FREQ=YEARLY;BYMONTH=11;BYDAY=1SU
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BEGIN:VEVENT
DTSTAMP:20211207T055411Z
LOCATION:Online
DTSTART;TZID=America/Chicago:20211117T103000
DTEND;TZID=America/Chicago:20211117T110000
UID:submissions.supercomputing.org_SC21_sess503_exses129@linklings.com
SUMMARY:How to Overcome the Pain Points of AI/ML Hardware
DESCRIPTION:Exhibitor Session\n\nHow to Overcome the Pain Points of AI/ML 
 Hardware\n\nSpencer\n\nAI/ML hardware faces three common pain points: memo
 ry bandwidth, computational throughput and on-chip data movement. Next-gen
 eration FPGA technology that includes a 2D network on chip, GDDR6 and mach
 ine learning processors presents new capabilities to alleviate these pain 
 points and offers a balance of speed, power and cost. Join us at this talk
  to find out how FPGAs and embedded FPGA (eFPGA) IP are ideal platforms fo
 r AI/ML inferencing solutions that provide the flexibility of a GPU while 
 performing at speeds similar to an ASIC.\n\nTag: Online Only\n\nRegistrati
 on Category: Tech Program Reg Pass, Workshop Reg Pass, Tutorial Reg Pass, 
 Exhibit Hall Only
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